3D & Systems Summit

The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D roadmap, Heterogeneous Integration and System-In-Package manufacturing.

The brand new agenda will focus on disruptive applications like Mobile IoT, High Reliability and High Performance.  Invited high-caliber speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.

2020 Main Topics and Highlights

  •     3DIC Through-Silicon-Via (TSV) technology
  •     2.5D, 3D FO-WLP/e-WLB
  •     Heterogeneous Integration
  •     Stacked dies and stacked wafers
  •     3D alternative technologies
  •     5G Applications
  •     uLED and photonics applications
  •     Invited speakers and Keynotes
  •     Exhibition area
  •     Networking opportunities

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