3D & Systems Summit

The 3D & Systems Summit  addresses the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing.

2021 Main Topics and Highlights

  • 3DIC Through-Silicon-Via (TSV) Technology
  • 2.5D, 3D FO-WLP/e-WLB
  • Heterogeneous Integration
  • Stacked Dies and Stacked Wafers
  • 3D Alternative Technologies
  • 5G Applications
  • uLED and Photonics Applications
  • Invited Speakers and Keynotes
  • Exhibition Area
  • Networking Opportunities

The Registration, the Agenda and more information here.

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