Roadmap and Challenges of Semiconductor Industry

Otto Graf

Otto Graf

"Roadmap 300mm Bosch-FAB Dresden"

“The new wafer fab is the biggest single investment in Bosch’s more than 130-year history, ” said Dr. Volkmar Denner, chairman of the board of management of Robert Bosch GmbH. To satisfy the demand generated by the growing number of internet of things (IoT), connected mobility and applications relating to smart homes and smart cities, the new location in Dresden is to manufacture electronic components including wafer level tests based on silicon technologies using 12-inch wafers for application specific integrated circuits. Construction of the high-tech plant is to be completed by the end of 2019 followed by the installation of equipment by 3rd quarter 2019. Following a rollout phase, manufacturing operations will likely start at the end of 2021. Highly automated production lines with fully connected data sources will enable efficient manufacturing processes, ensure reliable delivery and help to reach benchmark quality.

The use of Artificial Intelligence (AI) will enable to set up one of the most advanced and intelligent semiconductor fab in the world. AI will improve capacity, quality, and efficiency and support results with lowest cycle time, highest productivity, fastest learning and more stable processes. Total investment in the location will come to roughly one billion euros. As many as 700 new jobs are to be created in Dresden. With connectivity and automation growing, semiconductor and electronic components are being used in more and more areas of smart applications. By extending the semiconductor manufacturing capacity, Bosch is giving a sound basis for the future and strengthening its competitiveness and is going a very important step toward preserving and enhancing competitiveness. Bosch intends to collaborate closely with local companies, and in this way to reinforce not only Germany’s, but also Europe’s position as an industrial location.