"A New Collaborative Approach to reliability challenges in the automotive industry"
By 2030, 50% of the automotive costs are expected to be SC (semiconductor) components with the advent of driver assistance and automation technologies. While it is an exciting source of growth for the complete supply chain, the automotive industry sets a great challenge for all of us: reaching the ppb level in failure rate at the component level. Material purity and contamination control of large “killer particles”, as well as medium and smaller sizes could play key enabler roles to reduce latent defects. However, it requires a new collaborative approach to validate expectations and identify the most adequate investments to meet the “zero defects” goal. From the list of potential solutions, there is an increased value to tackle the “non-visible, Black Box particles” - those the installed metrology tools cannot detect - as sources of latent defects. Defectivity monitoring challenges may mask the presence of defect-causing particles and metal ions that affect the SC reliability in the latter years of the automobiles service life. The semiconductor industry is here in the 3rd generation of the contamination control strategy where baseline and excursion control could be improved with an adequate particle and metal ion management strategy. A collaborative engagement model exists where device makers and material purity experts work together in task force mode to build the capabilities required to enable the reliable electrification, connectivity and automation of transportation ecosystem. This is the “New Collaborative Approach”.