Silicon Europe reaches next steps

The Silicon Europe cluster partners are hard at work. After successful finishing work package two, it was now time to accelerate the work packages three and four. On January 20 and 21, 2014, the partners met in Grenoble, France, to go to work.

During their “WP 3 and 4 Meeting” in Grenoble, representatives of the Silicon Europe partners in Germany, France, the Netherlands, Belgium and Austria discussed the results of their work so far. The detailed analysis of the participating clusters/regions are outlined in three reports. First the “Regional cartography of RTD offer and demand”, second the “Regional SWOT analysis” and third the “Silicon Europe complementarities analysis.

Subsequently, the next steps for the already started work package 3 “Development of a Joint Action Plan” were discussed. Now the partners will generate sets of concepts and ideas for actions to be taken on a local, a regional, a national and the EU level. Part of this is also a comparison and evaluation of these ideas against the needs of the semiconductor business community. This will take place in regional and international workshops with both industry and community experts.

To further strengthen the European cluster alliance Silicon Europe, the work package 4 constantly calls for the identification of other relevant European partners in microelectronics and also the most important competing regions outside Europe. Furthermore, the cluster partners are screening the international market for possible international cooperation partners outside the already participating clusters.

The next work package meeting is scheduled for the Sixth European Semiconductor Cluster Forum in Cork, Ireland, on April 2 and 3, 2014. The Steering Committee will meet for the next work package session during the High Systems Conference in ‘s-Hertogenbosch, The Netherlands, on May 8 2014.