Webinar: Chiplet-based sensor fusion platform for autonomous driving and AGVs – an Overview
Based on the current state of integration technologies, our webinar shows possible integration approaches for chiplet-based multi-die systems to build future sensor fusion platforms, e.g. for ADAS and AGV applications. Furthermore, we discuss current and future chip-to-chip standards and their advantages and disadvantages for automotive and AGV applications.
Webinar language: English