Aktuelle Veranstaltungen

The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. Learn more about the use of lock-in thermography for failure analysis in electrical engineering and electronics in our online event.

A Glimpse into the Online Event

• Failure analysis and defect inspection
• Quality and process control
• Flexible R&D solution
• Basic configuration to turnkey solution
• Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules
• Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors

Eventwebsite and registration.