Aktuelle Veranstaltungen

Infrared Lock-in Ther­mo­graphy for Inspec­tion of Elec­tro­nics and Inte­grated Circuits

The thermographic inspection of electronic components and assemblies is an established test procedure for failure detection and quality management – from the development of first prototypes to serial production. Learn more about the use of lock-in thermography for failure analysis in electrical engineering and electronics in our online event.

A Glimpse into the Online Event

  • Failure analysis and defect inspection
  • Quality and process control
  • Flexible R&D solution
  • Basic configuration to turnkey solution
  • Hotspot detection on printed circuit boards, integrated circuits, semiconductor material and multi-chip modules
  • Detection of faulty thermal connections of heat sinks, short circuits, soldering defects and wire bonding errors

Eventwebsite and registration.

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