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The 26th edition of IITC ( International Interconnect Technology Conference) as a joint event with MAM (Materials for Advanced Metallization Conference) is sponsored by the IEEE Electron Devices Society as the premier conference for interconnect technology devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI applications. Prior to the technical program, a workshop featuring “Interconnect Challenges for Next Generation Computing” will be held.?

The conference seeks papers on all aspects of BEOL/MOL/3D interconnects and metallization, including design, unit process, integration and reliability. Authors are encouraged to submit their original work describing innovative research and development in the critically important field of on-chip interconnects and heterogeneous integration.

Event website.

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