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Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar.

Inspection Equipment, Measurement Equipment, Defect Inspection, Particle, Bump, Advanced Packaging Metrology and Inspection, Contamination Detection, Review, Die Inspection, Film Thickness, Uniformity Measurement, Ellipsometer, Metal Film Thikness, All Surface Inspection, Factory Monitoring and Control System, Automatic Defect Classification, Process Control, Production Control Software, Yield Management