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Intel: Telia, Ericsson and Intel First to Make 5G Real in Europe

EU Digital Summit – Tallinn, Estonia, Sept. 29, 2017 – Telia is deploying the first public 5G live network use cases in Europe in collaboration with Ericsson and Intel. This includes a high-speed 5G connection to a commercial passenger cruise ship delivering internet connectivity to the ship and its passengers while in port, and an industrial use case featuring a construction excavator remotely controlled with a live 5G network.

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faizod: Blockchain-based birth certificates for a more free society

Last month the state of Illinois (USA) announced plans for a pilot project implementing Blockchain technology to digitalise birth certificates. The initiative has the goal of giving citizens authority over their identities and eliminating the laborious paperwork method being used today. The state is reported to be working with a Utah software firm in establishing who ought to have access to the birth register /1/.

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Faizod: Dubai gears up to put land registry on Blockchain

Dubai is on the fast track to becoming the world’s first Blockchain-powered city. Dubai’s government media office announced recently that the Land Department has recently begun its own Blockchain program for real estate and lease registration, as a part of the UAE’s "Dubai Blockchain Strategy."

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faizod: Visa announces Blockchain platform

Last week Visa announced the test phase of a new Blockchain-based payment system called B2B Connect. MasterCard recently unveiled a similar platform, and Visas move signifies the arrival of Blockchain in financial technology outside the realm of cryptocurrencies.

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Intel: Intel and Cyberhawk Inspect Gas Terminal through Lens of Commercial Drone Technology

Intel and Cyberhawk, a global leader in aerial inspection and surveying, again revealed the power of commercial drone technology to drive business transformation by successfully inspecting a gas terminal in St Fergus, Scotland. Inspection with the Intel® Falcon™ 8+ system, instead of conventional methods, reduced employee risk, increased speed and accuracy, and saved $1 million to $5 million per day in potential production loss during the mission.

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HORIBA: Commencing Research with Shiga University on Utilization of Big Data from Measuring Instruments

Shiga University, a national university in Japan, has entered into an agreement with HORIBA, Ltd., HORIBA STEC Co., Ltd. and HORIBA Advanced Techno, Co., Ltd. for a collaborative effort in the fields of data science research and human resource development. The aim of this collaboration is to contribute to the creation of new value by utilizing measurement data results obtained from HORIBA products.

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faizod: Australian stock exchange turns to Blockchain

Australia’s main stock exchange, ASX, announced plans today to roll out a timeline for adopting Blockchain next year in March. ASX will be the first in the world to adopt Blockchain for this purpose, providing proof that Blockchain will fulfil its potential in the financial sector outside of cryptocurrencies.

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SILTECTRA: Highranked advisory board, including semiconductor industry veteran Joe Bronson

SILTECTRA GmbH, a technology specialist for kerfless wafering, is pleased to introduce a new addition to it’s top-ranked advisory board. The board delivers outstanding strategic and technology expertise, supporting the new CEO Dr. Harald Binder to elevate the company to the next level of commercialization. Semiconductor veteran Joe Bronson, who is highly acknowledged in the semiconductor industry, supports the strategy process.

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SILTECTRA: SILTECTRA develops SiC wafering process with kerf-loss far below 100µm

SILTECTRA GmbH, a technology specialist for kerfless wafering, continues to work on high volume manufacturing qualification and optimization of their unique wafering technology called COLD SPLIT. Recently, SILTECTRA has been able to establish a kerf-loss far below 100µm. The market standard is between 200 to 250µm or more for an optimized and well-established wafering technology. In order to realize this outstanding and for the industry, significant achievement, SILTECRA engineers have developed a laser process, enabling a premium homogeneity by dynamic control of the light source parameters.

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faizod: UPS enters Blockchain alliance

UPS officials reported their decision to joining the Blockchain in Trucking Alliance (BiTA). This alliance is made up of a number of logistics companies seeking to examine the benefits that Blockchain has to offer in the industry. The alliance has been formed in response to enormous growth in the shipping industry putting strains on its foundations.

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ams: The world’s first high performance "true wireless" ANC earbud is powered by ams’ best in-class ANC technology

ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today revealed that global earbud manufacturer Nuheara is using the miniature ams AS3412 Active Noise Cancellation (ANC) IC to provide best-in-class hybrid noise cancellation and audio amplifier functions for its new Live IQ earbuds. Nuheara, a leader in the hearing intelligence market, introduced its LiveIQ earbuds at the Consumer Electronics Show today.

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Cisco Systems: Cisco and Hyundai to Bring the Next Generation Car to 2019 Production

Cisco and Hyundai Motor Company announced the production of a next-generation, hyperconnected car. Hyundai will feature this new in-vehicle network in their premium 2019 vehicles. In 2016, Cisco and Hyundai reported plans to develop a vehicle with a new approach to communication. The companies would create a flexible and more secure platform that would offer a path to innovate and build on smart-vehicle solutions. With a unique combination of networking and auto expertise, the two companies agreed they could work at a faster pace together to disrupt the auto industry.

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GLOBALFOUNDRIES: STMicroelectronics Selects GLOBALFOUNDRIES 22FDX® to Extend Its FD-SOI Platform and Technology Leadership

GLOBALFOUNDRIES and STMicroelectronics (NYSE: STM) today announced that ST has selected GF’s 22nm FD-SOI (22FDX®) technology platform to support its next-generation of processor solutions for industrial and consumer applications. After deploying the industry’s first 28nm FD-SOI technology platform, ST is extending its commitment and roadmap by adopting GF’s production-ready 22FDX process and ecosystem to deliver second-generation FD-SOI solutions for the intelligent systems of tomorrow.

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NXP: NXP, LG Electronics and HELLA Collaborate on Automotive Vision Platform

NXP Semiconductors N.V. (NASDAQ:NXPI), LG Electronics and HELLA Aglaia have announced a strategic collaboration for automotive vision applications. The three powerhouses of automotive advanced driver assistance systems (ADAS) have created a new vision platform that will be made available to all automakers to promote best-in-class detection and classification of vulnerable road users to save lives. Already adopted by a major European OEM, the new vision platform takes aim at conventional, proprietary vision platforms that limit the choices of traditional and new disruptive carmakers. This effort is designed to bring rapid innovation to a crucial area of autonomous development and will help the industry meet the ambitious plans of global NCAP standards bodies.

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Smartrac: Showcases What the "Internet of Your Things" Has in Store

Smartrac is not simply showing the way toward the "Internet of Your Things". Together with its partners Blue Bite and Temera, the RFID and IoT pacesetter is also presenting innovative solutions and real-world examples of how brand owners and retailers can utilize it here and now. Once products are digitized via embedded RFID technology and the digital IDs associated with the tags are securely married with the product data, the stage is set for the profitable utilization of the newly created "Internet of Your Things".

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SEMI Europe: ISS Europe to Spotlight Key Industry Issue of Workforce Development

STEM education and a talent pipeline, critical issues to electronics manufacturing executives sharpening their competitive edge in the global supply chain, will be key focus areas at SEMI Europe’s Industry Strategy Symposium (ISS Europe). Day two of the flagship business event – March 4-6 in Dublin, Ireland – will feature two experts focusing on how companies can "Gain, Train and Retain World-Class Talent."

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Kinetics: Increased US Footprint with New Corporate Headquarters

Kinetic Systems, Inc., a global design/build provider of turnkey process systems, announced today the opening of its global headquarters in Livermore, Calif. The strategic location of the larger facility allows the company to combine its process and product engineering services under one roof, thereby expanding on the synergies of its equipment and facility management and support businesses.

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GLOBALFOUNDRIES: 45nm RF SOI Customer Prototypes for 5G Applications

GLOBALFOUNDRIES today announced that its 45nm RF SOI (45RFSOI) technology platform has been qualified and is ready for volume production. Several customers are currently engaged for this advanced RF SOI process, which is targeted for 5G millimeter-wave (mmWave) front-end module (FEM) applications, including smartphones and next-generation mmWave beamforming systems in future base stations.

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X-FAB: "IPO of the Year" Award received

On the occasion of the 2018 Euronext Annual Stock Exchange Conference, X-FAB Silicon Foundries SE today received the "IPO of the Year" award in the category large caps at an awards ceremony taking place in Paris. The award honors the successful Initial Public Offering of X-FAB, the company’s post-IPO performance and the significance of the listing for the Paris stock exchange. X-FAB is listed at Euronext Paris since the 6th of April 2017. In total, the IPO raised EUR 426.4 million. The group of advisors included BNP PARIBAS, HSBC, Credit Suisse, ODDO & Cie as well as Commerzbank as underwriters, Linklaters as legal advisor and KPMG as auditor.

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X-FAB: First Semiconductor Foundry to Achieve IATF 16949 Automotive Quality Certification

X-FAB Silicon Foundries SE today announced that it is the first semiconductor foundry whose manufacturing sites are certified for automotive manufacturing according to the new IATF-16949:2016 International Automotive Quality Management System (QMS). The certification is acknowledged as the industry’s highest standard of system and process quality for automotive suppliers. This achievement further strengthens X-FAB’s long-established reputation for quality and reliability in the automotive industry, as well as its standing among semiconductor manufacturers. Since 1992, the company has consistently met or exceeded the exacting demands for automotive semiconductors, with more than 17 billion X-FAB automotive devices shipped to date. Almost 50% of the company’s business is related to the automotive market and on average there are now 10 ICs produced by X-FAB in every newly manufactured vehicle worldwide.

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faizod: Blockchain Bundesverband welcomes Blockchain in Germany

A new lobby group for Blockchain in Germany recently announced plans to roll out a comprehensive strategy and legal framework for advocacy for welcoming Blockchain technology in Germany. The group sees a very positive future for the technology and sees the lack of regulation and oversight as a hindrance to the growth of the industry in Germany; they hope to help establish a market for the technology.

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Intel: Promise of Silicon Spin Qubits for Quantum Computing

Quantum computing is heralded for its potential to tackle problems that today’s conventional computers can’t handle. Scientists and industries are looking to quantum computing to speed advancements in areas like chemistry or drug development, financial modeling, and even climate forecasting. To deliver on quantum computing’s potential, Intel initiated a collaborative research program in 2015 with the goal of developing a commercially viable quantum computing system.

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ANSYS: Richard Childress Racing Leverages ANSYS to Improve Racecar Speeds

Richard Childress Racing (RCR) will improve racing times with ANSYS (NASDAQ: ANSS) through a new, multi-year partnership. RCR will leverage ANSYS Pervasive Engineering SimulationTM software to more accurately predict machine performance and enhance vehicle speed on the race track by enabling a true digital twin of a race car. A fraction of a second on the race track can determine which team takes the trophy, so NASCAR Monster Energy Cup Series teams must constantly improve speeds to stay competitive. A digital twin of the 2018 Chevrolet Camaro ZL1 will arm RCR engineers with a more complete understanding of how the physical racecar will operate under race track circumstances that are nearly impossible to test. Sensors and actuators on the physical car are used to build a digital twin that enables data capture, real-time analytics monitoring and predictive maintenance testing – empowering engineers to optimize vehicle performance before race days.

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Intel: Intel to Bring 5G to Mobile PCs Next Year

Intel is continuing to build new products and collaborations for 5G across the network, client and cloud. Today, Intel announced it is collaborating with Dell, HP, Lenovo and Microsoft to bring 5G connectivity to Windows PCs with Intel® XMM™ 8000 series commercial 5G modems. Intel expects the first high-performing 5G-connected PCs to surface in the market in the second half of 2019.

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ams: ams, X-Rite and PANTONE® to develop a mobile color sensing solution

ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, X-Rite Incorporated, a global leader in color science and technology, and X-Rite’s subsidiary Pantone LLC today announced a collaboration to develop an end-to-end mobile solution that embeds color management technology directly into a smartphone for accurate color matching. The joint solution would consist of an ams spectral sensor and optical components packaged into a miniaturised module. The combined offering would enable phone manufacturers and retailers to reshape how consumers search, match and purchase goods such as apparel, home décor or cosmetics using mobile devices.

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Goodix: Entry into the Growing NB-IoT Market with Acquisition of German-Based CommSolid

Goodix Technology (A-share: 603160), a world leader in biometric & human interface technologies announces its acquisition of CommSolid - the technology leader in the Cellular IP market. With CommSolid’s ultra-low power baseband solutions, in addition to Goodix’s RF chip design and development center in California, Goodix will be able to accelerate the development of differentiating SoCs (System-on-Chips) that target many new applications in smart homes, transportation, logistic systems, and industrial segments.

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FRT: Announcing the Winners of the 2018 3D InCites Awards

3D InCites announce the winners of the 2018 3D InCites Awards. 40 nominees from 26 companies and four research institutes competing for awards in 9 categories. Over 40,619 online votes were logged. The category with the most votes was Equipment Supplier of the year, with 9581 total votes. The winner in this category ist the Silicon Saxony Member FRT GmbH. This year’s awards will be presented during the iMAPS Device Packaging Conference, March 7, 2018, in Fountain Hills, Arizona. All nominees, winners, and attendees of IMAPS DPC are invited to attend the 3D InCites Awards Ceremony.

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HSEB: UNiTYSC acquires HSEB Dresden GmbH

UnitySC, a leader in advanced inspection and metrology solutions, today announced it acquired 100% of the shares of HSEB Dresden, GmbH (HSEB), a leading supplier in optical inspection, review and metrology for high-value semiconductor applications. Following the acquisition, the new entity’s extended line of leading-edge process control solutions will provide a unique and essential inspection and metrology capability to semiconductor manufacturers. Together, the entity’s offerings span substrate, front-end-of-line (FEOL) manufacturing, wafer-level packaging, 3D ICs and power semiconductors. Further, bringing together the two companies will strengthen worldwide customer support for all platforms.

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GLOBALFOUNDRIES: RF Ecosystem Program to Accelerate Time-to-Market for Wireless Connectivity, Radar and 5G Applications

GLOBALFOUNDRIES today announced a new ecosystem partner program, called RFwave™, designed to simplify RF design and help customers reduce time-to-market for a new era of wireless devices and networks. The last few years there has been an increasing demand for connected devices and systems that will require innovations in radio technologies to support the new modes of operation and higher capabilities. The RFwave Partner Program builds upon GF’s 5G vision and roadmap, with a focus on the company’s industry-leading radio frequency (RF) solutions, such as FD-SOI, RF CMOS (bulk and advanced CMOS nodes), RF SOI and silicon germanium (SiGe) technologies. The program provides a low-risk, cost-effective path for designers seeking to build highly optimized RF solutions for a range of wireless applications such as IoT across various wireless connectivity and cellular standards, standalone or transceiver integrated 5G front end modules, mmWave backhaul, automotive radar, small cell and fixed wireless and satellite broadband.

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Smartrac: Experiences Solution Wins IoT Global Award

Smartrac has won the 2018 IoT Global Award for its Experiences solution in the ‘Retail, Marketing & Hospitality’ service category. Judged by a panel of 12 Internet of Things (IoT) industry experts and insiders, the inaugural IoT Global Awards were announced in London on March 21. Experiences is Smartrac’s IoT-based solution that turns products into digital platforms for customer engagement innovation, and which already has a proven track record in deployment for many well-known global sports brands such as Spyder.

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Intel: Experience Counts, Particularly in Safety-Critical Areas

Society expects autonomous vehicles to be held to a higher standard than human drivers. Following the tragic death of Elaine Herzberg after being hit last week by a self-driving Uber car operating in autonomous mode in Arizona, it feels like the right moment to make a few observations around the meaning of safety with respect to sensing and decision-making.

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Kinetics: Kinetics Acquires Mega Fluid Systems

Kinetic Solutions, Inc., a full-service process and mechanical contractor for high-technology markets worldwide, announced today the acquisition of Mega Fluid Systems, a global supplier of chemical and slurry delivery equipment to the global semiconductor, LED, pharmaceutical, specialty chemicals and solar/PV industries. According to the details of the agreement, Mega Fluid Systems will operate as a Kinetics company, but will maintain its brand and product line. The acquisition marks another strategic decision in the latest string of investments to strengthen the Kinetics global footprint and position it as a leader in critical process facilities systems services, advanced process equipment and facility management solutions.

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Dream Chip: Arteris IP Supports Dream Chip Technologies Innovative Business Model for Automotive SoC Development

Arteris IP, the innovative supplier of silicon-proven commercial system-on-chip (SoC) interconnect semiconductor intellectual property (IP), today announced its support of Dream Chip Technologies’ pioneering business model to accelerate the development and deployment of next-generation automotive SoCs for autonomous driving, advanced driver assistance systems (ADAS), LIDAR controllers and radar controllers.

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NXP: Partner for New In-Vehicle Experiences

NXP Semiconductors N.V. (NASDAQ:NXPI), the world’s largest supplier of automotive semiconductors and AliOS, the operating system for Internet of Things (IoT) solutions developed by Alibaba Group, have entered into a partnership to further drive the development of smart cars in China. The partnership aims to install the AliOS system and NXP’s automotive infotainment solution in millions of vehicles in China by 2020. The collaboration will help build a next-generation smart cockpit enhanced by multi-screen display, artificial-intelligence-driven interaction and secure Over-the-Air (OTA) updates.

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GLOBALFOUNDRIES und Toppan: GF and Toppan Photomasks Extend Advanced Photomask Joint Venture in Germany

GLOBALFOUNDRIES Inc. (GF) and Toppan Photomasks, Inc. (TPI) today announced a multi-year extension to their Advanced Mask Technology Center (AMTC) joint venture in Dresden, Germany. Opened in 2002, the AMTC provides GF’s fabs in Dresden, Malta and Singapore with high-end production and development masks at world-class cycle times in support of the foundry’s ambitious technology roadmap. The AMTC also supports TPI customers worldwide from Dresden.

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SILTECTRA: Adding new Patents to Global Intellectual Property Portfolio

SILTECTRA GmbH, a leader in advanced wafering technology solutions and services, today announced that it has fortified its market position by adding three new patents to its global portfolio of intellectual property (IP). The first patent covers new technical capabilities relating to the company’s COLD SPLIT laser process and extends the approach to non-polymer applications. The second patent secures COLD SPLIT for all substrate materials. The third patent covers an extension of the company’s silicon carbide (SiC) process capability to split materials with sub-100-micron material loss, regardless of vendor-specific SiC crystal-growing processes.

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Intel: How is Artificial Intelligence Changing Science?

Intel’s Gadi Singer believes his most important challenge is his latest: using artificial intelligence (AI) to reshape scientific exploration. In a Q&A timed with the first Intel AI DevCon event, the Intel vice president and architecture general manager for its Artificial Intelligence Products Group discussed his role at the intersection of science — computing’s most demanding customer — and AI, how scientists should approach AI and why it is the most dynamic and exciting opportunity he has faced.

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Smartrac: idion disc™ Delivers a Stunning Performance at iHeartRadio’s Wango Tango

This year's iHeartRadio’s Wango Tango by AT&T concert in Los Angeles (Saturday, June 2) saw the first large-scale rollout of the idion disc™, a patented, skin-applied wearable with built-in NFC capability that is essentially imperceptible when worn. Developed by idion LLC, a leader in skin-applied wearables, in partnership with Smartrac Technology Group, a global leader in RFID products and Internet of Things solutions, the idion disc™ is a thin, flexible, skin-adherent, wearable device that enables brands and venues to enhance attendee and guest experiences, increase engagement and increase sponsorship and partnership revenue.

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faizod: Insights on the GDPR and what it means for Blockchain

The General Data Protection Regulation (GDPR) was instated on May 25th, 2018 as the first piece of data legislation applicable in all of Europe. Legislators began working on the bill in 2012 as a way to help individuals protect their personal information and give them more control over how their data is used. But how does the GDPR mesh with Blockchain?

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Intel: Testing Smallest ‘Spin Qubit’ Chip for Quantum Computing

Intel researchers are taking new steps toward quantum computers by testing a tiny new "spin qubit" chip. The new chip was created in Intel’s D1D Fab in Oregon using the same silicon manufacturing techniques that the company has perfected for creating billions of traditional computer chips. Smaller than a pencil’s eraser, it is the tiniest quantum computing chip Intel has made.

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faizod: Epic nautical voyage forges ahead with Blockchain

31 days left until the departure of an epic voyage being powered in part by faizod. On July 29th, 2018 the Open60AAL, the actualization of the "Ant Arctic Lab" project, will depart on a single-handed, non-stop, without assistance trip around the world. The journey will cover 34,000 nautical miles and set a new sailing record. The challenge is being undergone to push the envelope in technology, software, and engineering for sailing.

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ams: Laser arrays bring face recognition to Android-based smartphones

ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today announced that its low-power IR VCSEL laser emitter, the PMSIL, is enabling the world’s first implementation of user face recognition in a smartphone based on the Android™ platform. The Mi8 Explorer Edition, the new flagship smartphone from the fast-growing Chinese brand Xiaomi, includes a face recognition system which uses infrared (IR) vertical cavity surface-emitting laser (VCSEL) arrays from ams. The PMSIL is a complete VCSEL flood illuminator system with integrated eye-safety interlock, offering very high optical efficiency and minimizing the drain on the phone’s battery when emitting.

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NXP: Named One of World’s Most Impactful Industrial IoT Companies in 2018

NXP Semiconductors N.V. (NASDAQ:NXPI) has been named one of the world’s most impactful Industrial Internet of Things (IIoT) companies based on recent research by IoT ONE (iotone.com). "From end-node to the cloud, NXP provides an unrivaled portfolio for supporting the incredible growth of smart, connected solutions for the IIoT – including microcontrollers, microprocessors, connectivity, analog, sensors and RF technologies," said Erik Walenza, CEO, IoT ONE. "It is an honor to recognize NXP as one of the top companies influencing and driving growth in the Industrial IoT."

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GLOBALFOUNDRIES: Reshape of Technology Portfolio to Intensify Focus

GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets. GF is realigning its leading-edge FinFET roadmap to serve the next wave of clients that will adopt the technology in the coming years. The company will shift development resources to make its 14/12nm FinFET platform more relevant to these clients, delivering a range of innovative IP and features including RF, embedded memory, low power and more. To support this transition, GF is putting its 7nm FinFET program on hold indefinitely and restructuring its research and development teams to support its enhanced portfolio initiatives. This will require a workforce reduction, however a significant number of top technologists will be redeployed on 14/12nm FinFET derivatives and other differentiated offerings.

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Intel: Drone Solutions Modernize and Increase Efficiency for US Bridge Inspections

Intel collaborated with two departments of transportation to improve bridge inspections, supplementing manual inspections of the Daniel Carter Beard Bridge connecting Ohio and Kentucky and the Stone Arch Bridge in Minnesota. Throughout the inspections, Intel’s advanced automated commercial drone hardware and software solutions increased efficiency and produced more reliable data in a fraction of the time and cost of traditional methods.

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Fraunhofer IISB: Advanced X-ray Topography Tool Offers More Insights into Semiconductor Material Quality

Rigaku Europe SE and Fraunhofer IISB in Erlangen are pleased to announce the formation of a strategic partnership to revolutionize the characterization of semiconductor materials by X-ray topography; therefore, Rigaku has installed the latest generation X-ray topography tool, the Rigaku XRTmicron imaging system, at Fraunhofer IISB. Dr. Michael Hippler, president at Rigaku Europe SE in Neu-Isenburg, Germany, states: "We are proud to join forces with the highly experienced team at IISB for semiconductor substrate and epilayer characterization."

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Intel: Intel Capital Fuels Cloud Innovation with a combined $30 Million Investment in three Startups

Intel Capital today announced an investment in Catalytic, a four-year-old company that helps enterprise customers process data faster and more accurately by coordinating people, bots and artificial intelligence. The news follows investments announced last week in Fortanix and Pliops. These newest members of Intel Capital’s portfolio are advancing innovation through intelligent automation, data security and storage processor technology – all critical areas to the growth of cloud computing. Intel Capital invested a collective $30 million in the three companies.

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Intel: Intel gets specific on a national Strategy for AI

By Naveen Rao and David Hoffman At Intel, they believe that being a catalyst for change comes with the responsibility of ensuring the world is prepared for the technological transformations we help usher in. This has never been truer than it is for artificial intelligence (AI). AI has the potential to impact industries and workforces in profound ways, even as it unlocks enormous economic potential. AI is more than a matter of making good technology; it is also a matter of making good policy. And that’s what a robust national AI strategy will do: continue to unlock the potential of AI, prepare for AI’s many ramifications, and keep the U.S. among leading AI countries. At least 20 other countries have published, and often funded, their national AI strategies. Last month, the administration signaled its commitment to U.S. leadership in AI by issuing an executive order to launch the American AI Initiative, focusing federal government resources to develop AI. Now it’s time to take the next step and bring industry and government together to develop a fully realized U.S. national strategy to continue leading AI innovation.

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Intel: Powering Industry 4.0 for Smart Manufacturing and Data-Centric Transformation

We are well along the journey to Industry 4.0 – where analytics, artificial intelligence (AI) and the internet of things (IoT) drive intelligence, decision-making and productivity. The transformative opportunities and market potential of Industry 4.0 are massive: It’s expected to create up to $3.7 trillion in value within global manufacturing. We are still in the early adoption stages, with only 30 percent of companies actively deploying IoT solutions at scale. With the emergence of the industrial internet of things (IIoT) and AI, a new kind of cloud-connected, data-driven factory is emerging. It is not just a "smart factory," marked by greater machine automation. It is an "intelligent factory," defined by hyper-agility and autonomous production, where data is transforming business.

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Fraunhofer IISB: Ceramic Embedding Gives a Boost to Wide Bandgap Semiconductor Devices

The use of power electronics in challenging fields of application – such as electric vehicles or aerospace – implies high requirements concerning switching speed and reliability. In this context, conventional packaging technologies are often pushed to their limits. Scientists at Fraunhofer IISB have developed a novel packaging concept and technologies by embedding power semiconductor devices into ceramic circuit carriers. Their design offers high temperature stability, operation at high voltages, and hermetic sealing to provide maximum lifetime in harsh environments. This helps to fully exploit the great advantages of wide-bandgap semiconductors (WBG). Power modules based on this new approach are presented by Fraunhofer IISB at this year’s PCIM Europe exhibition in May 2019 in Nuremberg.

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SEMI: SEMI Partners with Powerhouses imec, CEA-Leti and Fraunhofer to Energize Global Innovation

SEMI, the industry association representing the global electronics manufacturing and design supply chain, today announced that in the three months since imec, a worldwide leader in nanoelectronics research, joined SEMI as a Strategic Association Partner under a Memorandum of Understanding (MOU) announced at the SEMI Industry Strategy Symposium (ISS) in January, two additional worldwide leaders in nanoelectronics research – CEA-Leti and Fraunhofer – agreed to join forces by signing similar agreements. By partnering with imec and now CEA-Leti and Fraunhofer, SEMI brings global scale to three of the world’s top technology research and innovation centers to support and inspire the development of new products and technologies by its more than 2,100 member companies.

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SEMI: Silicon Wafer Shipments Drop to Lowest Level Since Fourth Quarter of 2017

Worldwide silicon wafer area shipments dropped 5.6 percent during the first quarter 2019 when compared to the fourth quarter 2018 and are now at their lowest level since the fourth quarter of 2017 after silicon wafer shipments for the most recent quarter declined 1 percent quarter-over-quarter, according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry. Total silicon wafer area shipments fell to 3,051 during the first quarter from 3,234 million square inches in the previous quarter.

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IBM: How machine learning is different from artificial intelligence

When I first began thinking of ways I could apply my neuroscience degree to my newfound love of programming, I was immediately drawn to the study of artificial intelligence. It only took some hours of cursory research for me to stumble upon the term machine learning. At first, AI and machine learning seemed indistinguishable from each other, and this is the attitude often taken in media and by companies claiming to use AI technology in their products. In actuality, they are related, but quite distinct in both meaning and function. On the surface, machine learning is one of many branches within AI. The following diagram is a simple visual of how machine learning falls inside of AI. It is a part, but far from the entire story of how we create machine intelligence.

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Intel: Computer-Powered "Echolocation" Tech and Artificial Intelligence Research

Intel is presenting a series of research papers that further the development of computer vision and pattern recognition software and have the potential to radically transform future technologies across industries – from industrial applications to healthcare to education. The Intel team presented their research, which leverages artificial intelligence (AI) and ecosystem-sensing technologies to build complete digital pictures of physical spaces, during the Conference on Computer Vision and Pattern Recognition (CVPR), the premier annual computer vision event in Long Beach, California, from June 16-20.

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X-FAB: Highly-Sensitive SPAD and APD Devices Based on its Modular 180nm Process Technology

X-FAB Silicon Foundries, the leading analog/mixed-signal and specialty foundry, continues to develop ground-breaking semiconductor solutions to address the most difficult of design challenges. It has now announced the availability of avalanche photodiode (APD) and single-photon avalanche diode (SPAD) products for implementation in scenarios where there are extremely low light conditions to contend with and augmented sensitivity is required, as well as tight timing resolutions involved.

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Heliatek: Best Innovation-Led Clean-Tech Award

Good ideas attract funding and faithful followers — and the clean-tech pioneer Heliatek has a great one. Heliatek was founded by a group of clean-energy enthusiasts 13 years ago to create a breakthrough product: organic photovoltaic (OPV) solar film. Heliatek solar film panels are a study in sustainability. Combining less than one gram of organic material with some heat, pressure and technological wizardry, Heliatek can produce 1m2 of ultra-thin, lightweight, flexible solar film. The technology underpinning all this has enabled it to secure several rounds of venture funding from private and public coffers — and convinced the CFI.co judging panel that Heliatek is the worthy winner of the 2019 award for Best Innovation-Led CleanTech Growth (Germany).

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Intel and Auto Industry Leaders: New Automated Driving Safety Framework

Intel, in collaboration with 10 industry leaders in automotive and autonomous driving technology, today published "Safety First for Automated Driving," a framework for the design, development, verification and validation of safe automated passenger vehicles (AVs). The paper builds on Intel’s model for safer AV decision-making known as Responsibility-Sensitive Safety (RSS). "Industry collaboration on the safety of automated vehicles is key to realizing a safe and responsible autonomous future. We are proud to have contributed to the groundbreaking work to establish a framework for introducing automated vehicles that are safe by design. We look forward to collaboration with additional industry partners on this comprehensive framework as well as on Intel’s RSS model", explains Jack Weast, Intel senior principal engineer and vice president of Automated Vehicle Standards at Mobileye, an Intel company.

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