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Turck duotec GmbH

Turck duotec GmbH

Business Segments:
  • Communication
  • Medical Technology / Pharma
  • Computers
  • Environmental Technoloy
  • Automotive
  • Equipment
  • Electronic
Core Competences:
  • Chip manufacturing: Packaging
Specialisation:
  • Chip on Board
  • Flip Chip Technology
  • Semiconductor Packaging
  • Solder Ball Placement
  • III-V Substrates

Turck duotec GmbH, Beierfeld (Turck Beierfeld GmbH):

  • 14,500 sqm production and administration area
  • 1,600 customized electronic modules with currently 170m pcs of SMD components per year



Products and Services:
 
Developing and manufacturing of customized electronics, PCB, modules and complete systems, thickfilm-hybrids, chip processing, SMT and THT mounting, packaging, conformal coating, assembling of complete devices inclusive material and parts procurement. In accordance with EU guidelines ROHS of 13-2-3 the technical prerequisites and process training for installation of the lead-free production of electronics (packaging of integrated circuits) are successfully launched for reflow, iron and selective soldering, also for bonding and packaging.
Applications:

  • Development
  • Production (component purchasing and logistics, printed circuit boards and thick-film hybrid technology, SMD and THT assembly, reflow, selective and wave soldering, bond and COB technology, laser calibration, measurement and testing technology 
  • Packaging
  • Complete assembly
  • and more

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