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First Sensor Microelectronic Packaging GmbH

First Sensor Microelectronic Packaging GmbH

Business Segments:
  • Semiconductor Industry
  • Medical Technology / Pharma
  • Aerospace
  • Automotive
  • Electronic
Core Competences:
  • Chip manufacturing: Packaging
Specialisation:
  • Sensors
  • Chip on Board
  • Prototyping
  • Bonding
  • Flip Chip Technology

MPD GmbH develops and manufactures customised microelectronic systems, components and modules.
For processing semiconductor chips and sensors MPD uses very sophisticated technologies of assembly and packaging and clean room classes from 100 000 up to 100 MPD. We can handle quantities ranging from a few prototypes to small series to up to several million pieces. Our products are used in the automotive, safety and medical industry as well as in the electronic industry.
In addition, MPD develops procedures for new applications and increasingly, in cooperation with partners, its own system solutions for customized applications prior for CMOS camera systems and MEMS.

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