Finetech GmbH & Co. KG
- Semiconductor Industry
- Supplier: Equipment
- Equipment Supplier
- Electronics Packaging & Assembly
- Die Bonder
- Flip-Chip Bonder
Products and Services:
Bonding & Rework Equipment
The core business of Finetech is the manufacturing of high accuracy equipment for the opto-electronic, advanced packaging and professional SMD rework business. The company services customers in a broad range of industries, including aerospace, automotive, medical technology, consumer electronics, semiconductor, opto-electronics, defense and universities.
Manual, semi-automatic and automatic FINEPLACER® systems are available -modularly designed for maximum process flexibility. Depending on the configuration, the systems are at home in R&D, prototype environments as well as small series production. They cover a large range of assembly technologies: ultra sonic bonding, thermo compression bonding, adhesive technologies (dispensing, stamping and curing). Typical applications are the assembly of laser and photo diodes, laser bars, VCSEL, MOEMS or various C2W challenges as well as the professional hot gas rework of all kinds of SMD components.
+/-0.5 Micron Sub-micron Bonder®
The FINEPLACER® principle is based on a unique patented vision alignment system, allowing alignment of chip and substrate very easily. The most important issue, the placement accuracy, can be achieved with the FINEPLACER® lambda down to ± 0.5 micron. The certified accuracy of the automated FINEPLACER® pico ama is 5 micron @ 3 sigma.