- Semiconductor Industry
- Medical Technology / Pharma
- Environmental Technoloy
- Rail / Automotive
- Supplier: Materials
- Masken für OLED, Solar
- fälschungssichere Label
- DMC Label
- Electro Polishing
- Laser Marking
- Laser Engraving
- Laser Micro Processing
- Laser Micro Cutting
- Nano Deposition
- Laser Markable Labels
- Laser Fine Cutting
- Laser Micro Machining
- Precision Stencils
High precision laser micro processing is the main business of the DREMICUT GMBH.
A fascination for the enormous potential of lasers inspired Kalman Kirchner and Mike Müller to found the company KIRCHNER UND MÜLLER LASERTECHNIK GbR in 1991, shortly after the German reunification. This was one of the first laser-job-shops in East Germany.
After a successful transformation into a GmbH (limited company) in 1994, KIRCHNER UND MÜLLER LASERTECHNIK GMBH became one of the leading laser sub-contract finishers in Germany.
Both companies regarded laser micro machining as a specific market segment with strong future potential. Consequently, a new company called DREMICUT GMBH was founded in 2001. Its goal was to dedicate itself more strongly to this specialized field.
Today DREMICUT successfully produces laser-cut precision stencils for the electronic industry and specializes in fields such as the laser-micro-cutting of high precision parts used in a variety of industries such as the medical field and exclusive brand name mechanical watches.
It is the use of a very wide spectrum of modern laser systems from renowned manufacturers such as Rofin, Rofin-Baasel, DMG and LPKF that provides the technical basis for our first class laser machining. Nd:YAG-laser, Fibre-laser, CO2-laser, diode-laser and UV-laser systems are ready for use for all demanding applications. Not forgetting the importance of a high standard finish, our high resolution measurement machines provide a qualitative analysis of the results.
In addition to the technical prerequisites, it is our many years of experience, our company specific high quality standards and our enormous flexibility that allows the firm KMLT® to deliver to particularly challenging industries. We regularly supply high standard products to microelectronic companies, to car manufacturers, to medical instrument providers, and to the watch-industry, as well as to producers of renowned and exclusive luxury goods.
It is our highly qualified engineers with leading technological know-how, motivated workers with a very good professional knowledge and our modern equipment that provides the successful combination that makes the firm KMLT® a competent partner for your application.
One of the focus points of DREMICUT is the production of high precision metal stencils with modern laser equipment.
In particular the use of laser cut stencils for solder paste coating for the industrial fabrication of electronic components has become the established practice.
Professional stencil production requires tolerances that are in the single figure µm range. In order to achieve this, production is done under fully acclimatized conditions. High precision machines are necessary for micrometer accurate and reproducible results.
Standard SMD stencils can be ordered by using the Stencil configurator. Please note that the data provided by you in a finished form, does not undergo any individual data control and any advanced layout processing.
The following criteria belong to the scope and delivery range with relation to precision stencils:
Laser micro-cutting of SMD metal stencils from special stencil plates (stainless steel and nickel) up to a thickness of 600µm
- Metal stencil for the application of glue
- Step stencils
- Assembly and assembly control stencils
- Stencil for wafer bumping
- Special stencils for LTCC, BGA, Fine pitch applications
- Print stencil for the solar branch
- Special stencils with material thicknesses above 10µm
- Masks for OLED technology
and much more
- License free perforation for all common clamping systems
- Mechanical brushing for optimal doctor blade procedures
- Edge protection and protection from cut injuries
- Clamping systems – clip on frame of different ZelFlex types or from VectorGuard®
- Repair and maintenance of ZelFlex clamping systems
- Frames from aluminium or stainless steel cross-sections
- Complete frame packaging, tensioned cover with gauze, and gluing of the stencil
- Application of sieve filler and stencil paint
- Issuing of a quality report (Scan-check protocol or measurement protocol)
- Creation of data for 3D paste inspection
- Express service with daily delivery
SMD metal stencils from DREMICUT, laser cut with edge roughness from 2….3µm and pad wall chamfers below a defined angle are the basic requirements for optimal dispersion behavior of solder paste. These guarantee perfect print results.
The application of the relevant amounts of solder for the components is implemented primarily through the correct selection of the required stencil thickness. This selection is influenced by the basic design rules applicable to the components. A final decision, however, is always in the hands of experienced manufacturing engineers.
Normally, different volumes of the paste can be applied due to the professional design adjustments of the pad structure.
Alternatively stepped stencils can be used. In this case the required solder paste volumes are regulated by partial adjustment of the stencil thickness.
Precision stencils for wafer bumping, BGA, LTCC, Solar
Precision plates above 50µm thick are used for wafer bump stencils. These are processed tension free and to high accuracy in climate controlled conditions with highly accurate laser systems.
These place particularly high demands on the laser equipment and the engineer’s technical know-how.
It is dependent here upon placing the least thermal demand on the material. The results are deformation free stencils with up to several hundred thousand pads.
Special demands on the stencil production need to be considered for semiconductor and hybrid technologies.
By using these precision stencils different substances can be applied in print procedures.
Stencil for solder paste printing for a BGA component
In the case of printing using BGA/μBGA, LTCC, Solar, flip chip technologies and for particular high density stencils, metal foils are used with a material thickness from 20μm.
The production of these stencils, tension free, plane and with very high accuracy, places particularly high demands on our production technology and know-how.
As is true for the wafer bump stencils, the material must be minimally thermally affected in order to produce deformation free stencils with sometimes more than one hundred thousand openings.
Find more information: www.kmlt.de