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3D-Micromac AG

3D-Micromac AG

3D-Micromac AG

Business Segments:
  • Semiconductor Industry
  • Medical Technology / Pharma
  • Environmental Technoloy
  • Aerospace
  • Rail / Automotive
  • Equipment
  • Electronic
  • Photovoltaics
Core Competences:
  • Chip manufacturing: Packaging
  • Laser Equipment
  • Laser Micro-structuring
  • Rolle-zu-Rolle-Prozesse

3D-Micromac's microDICE system enables high-performance and cost-effective dicing of semiconductor wafer, including SiC
3D-Micromac's microDICE system enables high-performance and cost-effective dicing of semiconductor wafer, including SiC
3D-Micromac AG is the industry leader in laser micromachining.

We develop processes, machines and turnkey solutions at the highest technical and technological level. Our aim is to provide superb customer satisfaction even for the most complex projects.

3D-Micromac delivers powerful, user-friendly and leading edge processes with superior production efficiency. These proprietary technology innovations are now readily available on a worldwide scale.

perfect TLS-Dicing edge
perfect TLS-Dicing edge
Semiconductor Industry

Since its founding in 2002, 3D-Micromac AG has gained an established position as one of the leading suppliers of laser micromachining systems with sales and service partners in North America, Asia and Europe.

The different processing methods that are realized with our laser systems include micro drilling, signing, cutting, 2D and 3D structuring, welding as well as marking of different materials and thin films.

Extremely precise positioning systems, innovative beam-delivery concepts as well as numerous process monitoring methods offer the highest possible process reliability and a maximum speed of machining. The utilization of lasers possessing highest beam quality ensures excellent machining results regarding surface and edge quality with a minimum of damage to the material and marginal materials loss.

microDICE-System - automatic and manual handling
microDICE-System - automatic and manual handling
TLS-Dicing™ System for Separation of SiC Wafers

3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality while increasing yield and process throughput. This is particularly true for silicon carbide (SiC) substrates, which are hard and brittle.

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